Passa på och lyssna till Dow Cornings specialister på nyutvecklade silikonlim mot elektronikindustrin!
When assembling electronics modules, manufacturers can optimize processes to reduce costs.
The choice of adhesive can greatly impact those costs, through the energy use, process time and other factors. Learn about the less-obvious ways that your choice of adhesives can make your process more efficient.
This webinar looks at the newest silicone adhesive technologies and how they are providing more options to optimize your assembly processes.
These innovations include Quick in Connect (QiC) adhesives, high "green strength"adhesives, Thermal Radical Cure(tm) adhesives, and the new fast low-temperature cure adhesive (Dow Corning® EA-6060 Adhesive).
The webinar will compare the new silicone adhesives with more-traditional options, discussing cure times, energy needed for curing (if any), adhesion profiles (robustness), pricing, "green strength," and applications.
In case there are any questions related to the webinar, contact us here.
When? Thursday, October 19, 2017
Time? 3:00 PM CEST